SYSTEM AND METHOD FOR ACQUIRING ALIGNMENT MEASUREMENTS OF STRUCTURES OF A BONDED SAMPLE
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United States of America Patent
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Issued Date -
Mar 21, 2024
app pub date -
Sep 16, 2022
filing date -
Sep 16, 2022
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Abstract
Systems and methods for acquiring measurements of structures of a bonded sample are disclosed. Such systems and methods may include determining a first registration measurement of a first registration structure and a first interface target structure of a first sample, and a second registration measurement of a second sample prior to coupling the samples together. Such systems and methods may include, after such a coupling of the samples, determining a third registration measurement of the coupled sample at least partially by measuring the first registration structure through the top face of the first sample. Such systems and methods may include acquiring an overlay measurement based on the first registration measurement, the second registration measurement, and the third registration measurement. Such systems and methods may include adjusting an inter-sample coupling recipe based on the overlay measurement, where the inter-sample coupling recipe may include a final bonding recipe.
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