Terrapin System
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United States of America Patent
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Issued Date -
Mar 14, 2024
app pub date -
Sep 14, 2022
filing date -
Sep 14, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a terrapin for installing a pipe foundation and works by sandwiching soil for final pin placement. The terrapin is a system used to strengthen unconfined soil layers. The terrapin dramatically reduces the potential for project site disruption by creating a sandwich of the soil layers to strengthen the soil properties during pin placement and installing a casing.
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