RESIN COMPOSITION AND RESIN MOLDED ARTICLE

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United States of America Patent

APP PUB NO 20240084098A1
SERIAL NO

18272887

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a resin composition with which a resin molded article having excellent heat dissipation can be obtained. A resin composition containing: a thermoplastic resin; graphite; and a fibrous body, when the resin composition in a molten state is filled in a mold from a direction orthogonal to a thickness direction of a resulting resin molded article 1 and molded to obtain a resin molded article 1 of 100 mm in length×100 mm in width×2 mm in thickness, in a cross-section obtained by cutting the resin molded article 1 along a direction X parallel to a filling direction and a thickness direction Z, among regions 1A to 1E obtained by dividing the cross-section into five equal parts in the thickness direction Z, an average orientation angle (A) with respect to a plane direction of the graphite in at least one of the regions 1A and 1E on outermost layer sides being 15° or less, and an average orientation angle (B) with respect to the plane direction of the graphite in the central region 1C being 35° or more.

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Patent Owner(s)

Patent OwnerAddress
SEKISUI TECHNO MOLDING CO LTDTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIGUCHI, Isao Osaka, JP 22 77
MASUDA, Takuya Toyohashi-city, Aichi, JP 29 397
MATSUMURA, Ryuuji Toyohashi-city, Aichi, JP 3 2
SHINOHARA, Takamichi Osaka, JP 6 0
SUENAGA, Yuusuke Toyohashi-city, Aichi, JP 4 4

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