ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURES
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United States of America Patent
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Issued Date -
Mar 7, 2024
app pub date -
Sep 1, 2023
filing date -
Sep 23, 2021
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Abstract
The instant disclosure relates to EMI shielding structures. A conductive composition is formed that includes a polymer and graphene present as a 3D-matrix therein. Rectangular EMI shielding panels are formed using the composition. Rectangular EMI shielding panels are affixed orthogonal to each other. The EMI shielding panels are successively overlapped to form a plurality of interconnected EMI shielding planes. The EMI shielding panels are affixed to each other to form a helical EMI shielding structure that folds and unfolds along its center axis. The EMI shielding planes are angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer. The EMI shielding planes rotate about the center axis when the HES structure transitions between the folded and unfolded states.
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