PHOTOMASK AND METHODS FOR MEASURING AND MANUFACTURING THE PHOTOMASK

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United States of America Patent

APP PUB NO 20240077804A1
SERIAL NO

17900937

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Abstract

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A method includes forming a test pattern and a reference pattern in an absorption layer of a photomask structure. The test pattern has a first trench and a second trench, the reference pattern has a third trench and a fourth trench, the test pattern and the reference pattern have substantially the same dimension in a top view, and the second trench is deeper than the first trench, the third trench, and the fourth trench. The method further includes emitting a light beam to the test pattern to obtain a first interference pattern reflected from the test pattern, emitting the light beam to the reference pattern to obtain a second interference pattern reflected from the reference pattern; and comparing the first interference pattern with the second interference pattern to obtain a measured complex refractive index of the absorption layer.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU 300-77

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Chien-Cheng Hsinchu County, TW 92 390
HSU, Pei-Cheng Taipei City, TW 111 530
HUANG, Shih Ju New Taipei City, TW 1 0
LEE, Hsin-Chang Hsinchu County, TW 203 1090
LIEN, Ta-Cheng Hsinchu County, TW 104 198
LIN, Ping-Hsun New Taipei City, TW 33 21

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges203382101 - 1021 - 3001002003004005006007008009001000110012001300140015001600170018001900200021002200

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