REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME
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United States of America Patent
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Issued Date -
Feb 29, 2024
app pub date -
Feb 17, 2023
filing date -
Aug 26, 2022
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Abstract
A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.
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