IN-CHAMBER METROLOGY OF SUBSTRATES FOR PROCESS CHARACTERIZATION AND IMPROVEMENT
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United States of America Patent
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Issued Date -
Feb 29, 2024
app pub date -
Aug 25, 2022
filing date -
Aug 25, 2022
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Abstract
A method includes receiving, by a processing device, first data generated by a first sensor of a substrate processing system. The first data is generated responsive to the first sensor receiving electromagnetic radiation from a substrate held by a robot arm of a transfer chamber in the substrate processing system. The method further includes processing the first data to obtain second data. The second data includes a first indication of performance of the substrate processing system. The method further includes causing, in view of the second data, performance of a corrective actions associated with the substrate processing system.
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