Miniature Pressure/Force Sensor With Integrated Leads
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United States of America Patent
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Issued Date -
Feb 29, 2024
app pub date -
Nov 9, 2023
filing date -
Feb 3, 2016
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Abstract
A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.
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