Importance

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Abstract

A substrate processing apparatus includes a vacuum chamber, a rotary table rotatably provided in the vacuum chamber, a stage having a mounting surface on which a substrate is mounted at a position spaced apart from a rotation center of the rotary table, a lift pin configured to be displaced relative to the stage through a through-hole of the stage to raise and lower the substrate, and a gas suctioning section configured to apply a suction force to the substrate via the through-hole when the lift pin is being lowered. The stage includes a groove on the mounting surface, the groove communicating with the through-hole and extending from the through-hole toward a center of the stage.

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First Claim