MICRO-TRANSFER PRINTING STAMPS AND COMPONENTS
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United States of America Patent
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Issued Date -
Feb 29, 2024
app pub date -
Nov 7, 2023
filing date -
Mar 30, 2020
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Abstract
A micro-transfer structure comprises a stamp comprising a rigid support, only a single contiguous bulk layer disposed on the rigid support, and posts disposed on the bulk layer. Components are adhered to (e.g., disposed in contact with) some but not all of the posts. The posts can be substantially identical and disposed in a regular array on the bulk layer. Each component is adhered to (e.g., in contact with) two or more posts. Components can be disposed on a source wafer entirely over sacrificial portions of a sacrificial layer on or in the source wafer and attached to anchors disposed between sacrificial portions with a tether.
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