EPOXY RESIN COMPOSITION AND TRANSPARENT COMPOSITE MATERIAL COMPRISING SAME, AND LAMINATED BOARD
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United States of America Patent
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Issued Date -
Feb 29, 2024
app pub date -
Jul 30, 2021
filing date -
Dec 28, 2020
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Abstract
An epoxy resin composition, a transparent composite material including the same, and a laminated board. The epoxy resin composition includes an epoxy resin A and an epoxy resin B. The refractive index of the epoxy resin A is 1.54-1.8 and the light transmittance of the epoxy resin A is 90%. The refractive index of the epoxy resin B is 1.54-1.8 and the light transmittance of the epoxy resin B is greater than 90%. The epoxy resin A is an organosilicon modified epoxy resin. The epoxy resin B is another type of epoxy resin. The organosilicon modified epoxy resin satisfying a specific condition and another type of epoxy resin also satisfying the specific condition are combined to form a specific epoxy resin composition. The composite material prepared from the epoxy resin composition, a curing agent, and a curing accelerator has the advantages of having high light transmittance and high bending strength, and also has high bonding strength.
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