AUDIO MODULES WITH WIRE DAMPENERS
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United States of America Patent
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Issued Date -
Feb 22, 2024
app pub date -
Aug 17, 2022
filing date -
Aug 17, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
Implementations of the subject technology provide an acoustic module with a dampening component integrated within the acoustic module to reduce deflection of a wire for a voice coil. The dampening component can take the form of an adhesive or a semisolid. During operation of the audio module, the wire vibrates and deflects in an oscillating manner. However, the dampening component can reduce the magnitude of deflection, while allowing the audio module to function in a desired manner, i.e., generate acoustical energy. By reducing the magnitude of deflection, the dampening component reduces the likelihood of mechanical fatigue of the wire, thus reducing the likelihood of damage to the wire.
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