PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Feb 15, 2024
app pub date -
Jan 20, 2023
filing date -
Aug 10, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board includes a substrate, a first pad and a second pad, respectively disposed on an upper side of the substrate, a first socket disposed in the substrate and including a first circuit, and a first trace disposed in the substrate and disposed between the first and second pads and the first socket with respect to a lamination direction. At least a portion of the first circuit is electrically connected to each of the first and second pads, and is electrically connected to the second pad through a path passing through the first trace.
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