SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

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United States of America Patent

APP PUB NO 20240055235A1
SERIAL NO

18383602

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Abstract

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A substrate processing apparatus for processing a substrate includes: a processing chamber in which a processing space for the substrate is formed; a heating mechanism that adjusts an inner temperature of the processing chamber; and an inner member provided inside the processing chamber, wherein the heating mechanism includes an induction heating element that heats at least the inner member by generating heat with an induction magnetic field, and a magnetic field generator that generates the induction magnetic field.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MASUYAMA, Masataka Miyagi, JP 2 0
MATSUMOTO, Naoki Miyagi, JP 303 9159
MIHARA, Naoki Miyagi, JP 20 1188

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