ADHESIVE BONDING METHOD FOR AUTOMATED PROCESSES
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United States of America Patent
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Feb 15, 2024
app pub date -
Mar 11, 2022
filing date -
Mar 18, 2021
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Abstract
A method for adhesively bonding two substrates, including the steps: (a) applying a liquid, radiation-curable primer composition onto the surface of a first substrate; (b) curing the liquid, radiation-curable primer composition by applying radiation with a suitable wavelength, intensity and temporal exposure such that the radiation-curable primer composition is cured into a solidified, coherent or interrupted layer adhering to the surface of the substrate; (c) optionally storing the primed substrate for a time of up to 6 months; (d) applying a curable adhesive composition onto the cured primer composition on the substrate; (e) joining a second substrate to the adhesive composition on the first substrate such that an adhesive bond is formed between the substrates, wherein the surface of the second substrate to be adhesively bonded is optionally pre-treated to improve adhesion before step (e) is performed; (f) curing the curable adhesive composition.
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