LASER PROCESSING MACHINE AND MANUFACTURING METHOD OF WAFER
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United States of America Patent
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Issued Date -
Feb 15, 2024
app pub date -
Jul 27, 2023
filing date -
Aug 10, 2022
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Abstract
A laser oscillation unit of a laser processing machine for manufacturing a SiC wafer from a SiC ingot includes a seed laser that emits a pulsed laser beam at predetermined pulse intervals, a splitter unit that splits the pulsed laser beam emitted by the seed laser, into at least a first pulsed laser beam and a second pulsed laser beam, a delay unit that delays one of the first pulsed laser beam and the second pulsed laser beam, a merger unit that merges the first pulsed laser beam and the second pulsed laser beam on a downstream side of the delay unit, and an amplifier arranged on a downstream side of the merger unit. A manufacturing method of a SiC wafer from a SiC ingot is also disclosed.
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