ULTRA-THIN SOLDERING GASKET AND PREPARATION METHOD THEREFOR, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE
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United States of America Patent
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N/A
Issued Date -
Feb 15, 2024
app pub date -
Dec 13, 2021
filing date -
Dec 16, 2020
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Embodiments of the present invention relate to the field of soldering sheets, and provided therein are an ultra-thin soldering gasket and a preparation method therefor, a soldering method, and a semiconductor device. The ultra-thin soldering gasket comprises: an internal support structure and a solder layer which covers a surface of the internal support structure, the solder layer being formed by uniformly attaching a solder liquid to the surface of the internal support structure. The preparation method for an ultra-thin soldering gasket comprises the following steps: immersing an internal support structure that has passed through a surface treatment process into a solder liquid, then removing same, and cooling. The soldering method based on the ultra-thin soldering gasket comprises: placing an ultra-thin soldering gasket between soldering surfaces to be soldered, and then performing reflux soldering to form a semiconductor device. The ultra-thin soldering gasket is flat and is not warped, solders are uniform, the minimum thickness of a single layer is only five micrometers, and high-accuracy soldering requirements can be met.
First Claim
Other Claims data not available