PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Feb 8, 2024
app pub date -
Feb 1, 2023
filing date -
Aug 2, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board includes: a bridge including a first insulating material, a wiring pattern disposed in the first insulating layer, a metal post disposed on the first insulating material and connected to the wiring pattern, and a second insulating material disposed on the first insulating material and covering at least a portion of the metal post; a first build-up insulating material disposed around the bridge; and a first redistribution pattern disposed on the second insulating material and the first build-up insulating material and including a metal pad connected to the metal post.
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