SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

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United States of America Patent

APP PUB NO 20240047581A1
SERIAL NO

17816742

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Abstract

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A semiconductor structure includes a semiconductor substrate, a gate electrode, a first spacer, and a first contact etch stop layer (CESL). The semiconductor substrate includes a fin structure. The gate electrode is over the fin structure. The first spacer is over the fin structure and on a lateral side of the gate electrode, wherein a top surface of the first spacer is inclined towards the gate electrode. The first CESL is over the fin structure and contacting the first spacer, wherein an angle between the top surface of the first spacer and a sidewall of the first CESL is less than about 140°.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, RYAN CHIA-JEN Hsinchu, TW 173 1719
CHIANG, CHIH-LONG Hsinchu County, TW 5 28
CHUANG, PO-HSIANG Taipei City, TW 1 0
HSIAO, CHUN-CHAN Hsinchu City, TW 3 14
HSU, SHAO-HUA Taitung City, TW 40 278
LAI, YEN-CHENG Tainan City, TW 9 47
LIN, YIH-ANN Hsinchu, TW 73 773
TANG, WEI-YEH Taoyuan County, TW 6 87
WENG, MAO-LIN Taoyuan City, TW 1 0
WU, CHIH-WEI Hsinchu, TW 162 902

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