SEMICONDUCTOR PACKAGE STRUCTURE
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United States of America Patent
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Issued Date -
Feb 8, 2024
app pub date -
Jul 28, 2023
filing date -
Aug 8, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package structure include a silicon substrate, a plurality of dies on the silicon substrate, a mold layer between the plurality of dies, a metal layer covering an upper side of the mold layer and at least a part of upper sides of each of the plurality of dies, and including an opening that exposes a part of the upper side of at least one die among the plurality of dies, and a temperature controller configured to control a temperature of the plurality of dies, the temperature controller including a body defining a circulation region configured to circulate a fluid for controlling the temperature of the plurality of dies, and a passage part configured to allow the fluid to flow into or out of the circulation region, and the fluid in the circulation region being in direct contact with exposed upper sides of the plurality of dies.
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