SUBSTRATE LOADING APPARATUS, SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME, AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SEMICONDUCTOR MANUFACTURING EQUIPMENT

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United States of America Patent

APP PUB NO 20240047253A1
SERIAL NO

18177300

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate loading apparatus includes a pickup apparatus configured to move a magazine in a first direction, a second direction and a third direction, an elevator defining a plurality of waiting spaces, a stage configured to support the magazine, and an insert apparatus configured to transfer substrates in the magazine. At least one of the plurality of waiting spaces of the elevator is configured to selectively receive the magazine, and the pickup apparatus is spaced apart from the elevator and the stage in the third direction.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO 16677

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOI, Youngshin Suwon-si, KR 6 17
JANG, Sangho Suwon-si, KR 7 4
KIL, Kibeom Suwon-si, KR 2 1
KIM, Yeongseok Suwon-si, KR 19 41
LEE, Dongsoo Suwon-si, KR 103 620
OH, Wooram Suwon-si, KR 15 4

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