HIGH ENTROPY, HIGH DIELECTRIC SWING HETEROGENEOUS MATERIALS
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United States of America Patent
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Issued Date -
Feb 8, 2024
app pub date -
Aug 7, 2023
filing date -
Aug 8, 2022
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Abstract
Devices, systems, and methods for micro-scale capacitance excursions in a porous medium are provided. A method can include forming pores in polymer or a metal oxide powder resulting in a porous film, injecting conductive nanoparticles into the porous film resulting in a conductive porous film, and curing the conductive porous film resulting in the high entropy, high dielectric swing heterogeneous film.
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