PHOTOSENSITIVE RESIN COMPOSITION
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United States of America Patent
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Feb 8, 2024
app pub date -
Feb 8, 2022
filing date -
Feb 12, 2021
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Abstract
A photosensitive resin composition including an alkali-soluble resin, a photoacid generator, a first organic solvent, and a second organic solvent different from the first organic solvent, in which the alkali-soluble resin includes at least one selected from a polyimide resin, a polyimide resin, and precursors thereof, the second organic solvent includes a heterocyclic compound having a carbonyl Group (provided that N-methyl-2-pvrrolidone is excluded), and the amount or the second organic solvent is 0.001% by mass or more and 4.0% by mass or less with respect to the entire photosensitive resin composition.
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