Bundling Apparatus and Method for Making Preform Charges

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240042708A1
SERIAL NO

18229604

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Abstract

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A bundling apparatus for fabricating a preform charge consisting of plural preforms includes a guide module, a tacking module, a bundle-advancement module, and a cutting module, and optionally one or more of a bending module, a scoring module, and inspection module, a consolidation module, and a placement module.

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Patent Owner(s)

Patent OwnerAddress
ARRIS COMPOSITES INC710 BANCROFT WAY BERKELEY CA 94710

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AUGUST, Zachary Aaron San Mateo, US 11 13
CHEUNG, ATKINSON Rose Emeryville, US 1 0
DIGIORGIO, Scott Berkeley, US 1 0
ODEN, Greg Garden City, US 1 0
SHIMSHAK, Maxwell Harshorn Oakland, US 6 40

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