BACKING MATERIAL FOR ULTRASONIC PROBE, METHOD FOR MAKING SAME, AND ULTRASONIC PROBE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240042488A1
SERIAL NO

18269408

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A backing material for an ultrasonic probe according to the present invention comprises a carbonaceous matrix that has communicating holes distributed in the matrix, and a resin with which the communicating holes are filled.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
MITSUBISHI PENCIL COMPANY LIMITED23-37 HIGASHIOOI 5-CHOME SHINAGAWA-KU TOKYO 1408537 ?1408537

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
OHNO, Toshiki Gunma, JP 2 6
YAMADA, Kunitaka Gunma, JP 19 75

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation