Micro-Mechanical Resonator Having Out-of-Phase and Out-of-Plane Flexural Mode Resonator Portions
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United States of America Patent
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Issued Date -
Feb 1, 2024
app pub date -
Jul 29, 2022
filing date -
Jul 29, 2022
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Abstract
A micro-mechanical resonator die includes: micro-mechanical resonator die layers; a cavity formed in at least one of the micro-mechanical resonator die layers; and a micro-mechanical resonator suspended in the cavity. The micro-mechanical resonator includes: a base; a first resonator portion extending from the base along a first plane; and a second resonator portion extending from the base along a second plane. The first resonator portion is configured to operate in an out-of-plane flexural mode that displaces at least part of the first resonator portion out of the first plane. The second resonator portion is configured to operate in an out-of-plane flexural mode that displaces at least part of the second resonator portion out of the second plane and out-of-phase relative to the first resonator portion.
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