BIODEGRADABLE HARDWARE
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United States of America Patent
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Issued Date -
Feb 1, 2024
app pub date -
Oct 13, 2023
filing date -
Jun 30, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
A biodegradable electrical enclosure is provided and has a plate having a rear mounting surface and a front appearance surface. An aperture extends through the plate for receiving an electrical component. The plate is formed of a natural fiber thermoset composite (NFTC) having at least one fire-retardant additive.
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