METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
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United States of America Patent
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Issued Date -
Feb 1, 2024
app pub date -
Oct 10, 2023
filing date -
Aug 13, 2015
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Abstract
A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.
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