SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
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United States of America Patent
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Issued Date -
Feb 1, 2024
app pub date -
Jul 28, 2023
filing date -
Jul 29, 2022
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Abstract
A substrate processing method includes an oxidation step of heating a plurality of substrates inside an oxidation space while supplying an oxygen gas or an ozone gas to the plurality of substrates to change surface layers of molybdenum films to molybdenum trioxide, a first transfer step of transferring the plurality of substrates inside the oxidation space to an etching space inside the substrate processing apparatus differing from the oxidation space, and an etching step of supplying an etching liquid to the plurality of substrates inside the etching space to make the surface layers that changed to the molybdenum trioxide dissolve in the etching liquid while leaving, on the substrate, portions other than the surface layers of the molybdenum films.
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