FILM MOLDING COMPOSITION AND FILM

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United States of America Patent

APP PUB NO 20240034859A1
SERIAL NO

17638790

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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[Problems] A composition capable of forming a film having both good solubility and good strength, and the film are provided.

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Patent Owner(s)

Patent OwnerAddress
SHIN-ETSU CHEMICAL CO LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MATSUSUE, Shintaro Niigata, JP 5 1

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