COMPOSITE SUBSTRATE

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United States of America Patent

APP PUB NO 20240022229A1
SERIAL NO

18370612

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Abstract

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A composite substrate that is obtained by bonding a silicon (Si) wafer having an interstitial oxygen concentration of 2 to 10 ppma to a piezoelectric material substrate as a support substrate, and thinning the piezoelectric material substrate after the bonding.

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Patent Owner(s)

Patent OwnerAddress
SHIN-ETSU CHEMICAL CO LTDTOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AKIYAMA, Shoji Gunma, JP 180 1705
SHIRAI, Shozo Gunma, JP 18 69
TANNO, Masayuki Gunma, JP 37 166

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