METHODS AND APPARATUS FOR CONTROLLING PLASMA IN A PLASMA PROCESSING SYSTEM

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United States of America Patent

APP PUB NO 20240021408A1
SERIAL NO

18475006

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods and apparatus for processing a substrate in a multi-frequency plasma processing chamber are disclosed. The base RF signal pulses between a high power level and a low power level. Each of the non-base RF generators, responsive to a control signal, proactively switches between a first predefined power level and a second predefined power level as the base RF signal pulses. Alternatively or additionally, each of the non-base RF generators, responsive to a control signal, proactively switches between a first predefined RF frequency and a second predefined RF frequency as the base RF signal pulses. Techniques are disclosed for ascertaining in advance of production time the first and second predefined power levels and/or the first and second predefined RF frequencies for the non-base RF signals.

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Patent Owner(s)

Patent OwnerAddress
LAM RES CORPAMERICAN CALIFORNIA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lyndaker, Bradford J Lowville, US 52 884
Valcore,, JR John C Worthington, US 90 2067

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