LEAF SPRING FOR AN INTEGRATED CIRCUIT HEAT SINK
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United States of America Patent
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Issued Date -
Jan 18, 2024
app pub date -
Apr 20, 2021
filing date -
Apr 20, 2021
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Abstract
A leaf spring for coupling a heat sink to an integrated circuit includes a central portion that has an aperture; a first spring arm that is formed on a first side of the central portion and includes a first through-hole for a first fastener; a second spring arm that is formed on a second side of the central portion and includes a second through-hole for a second fastener; a first bending axis that passes through the first side and is substantially perpendicular to a longitudinal axis of the leaf spring that passes through the first through-hole and the second through-hole; and a second bending axis that passes through the second side and is substantially perpendicular to the longitudinal axis of the leaf spring.
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