ULTRASONIC TRANSDUCERS, BACKING STRUCTURES AND RELATED METHODS
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United States of America Patent
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Issued Date -
Jan 18, 2024
app pub date -
Nov 17, 2020
filing date -
Nov 18, 2019
priority date (Note) -
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Abstract
There is provided an ultrasonic transducer having a sample-contacting portion and a back portion, the back portion being opposed to the sample contacting portion. The transducer includes a piezoelectric material configured to be in acoustic communication with a sample and a backing structure in acoustic communication with the piezoelectric material. The backing structure is configured to reflect acoustic energy towards the sample-contacting portion and away from the back portion of the ultrasonic transducer. The backing structure includes a low acoustic impedance layer and a high acoustic impedance layer. The transducer may also include a second dual layer de-matching backing. The second dual layer de-matching backing includes a second low acoustic impedance layer and a second high acoustic impedance layer. There are also provided ultrasonic transducers including a one-dimensional piezoelectric array or a two-dimensional piezoelectric matrix and including backing structure configured to reflect acoustic energy.
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