FAN-OUT SEMICONDUCTOR PACKAGE
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United States of America Patent
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Issued Date -
Jan 11, 2024
app pub date -
Sep 21, 2023
filing date -
Jun 23, 2016
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Abstract
A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.
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