FLIP CHIP PACKAGE AND SUBSTRATE THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 11, 2024
app pub date -
Jun 27, 2023
filing date -
Jul 8, 2022
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
In a flip chip package, lines, an identification line and a dummy line are provided on a first surface of a light-transmissive carrier, and a supportive layer is disposed on a second surface of the light-transmissive carrier. Bumps and an identification bump of a chip are bonded to the lines and the identification line, respectively. Shadows of the dummy line, the identification line and the identification bump which are projected on the second surface are visible from an opening of the supportive layer. The shadows can be inspected through the opening so as to know whether the bumps are bonded to the lines correctly.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully