SEMICONDUCTOR PACKAGE
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United States of America Patent
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Issued Date -
Jan 11, 2024
app pub date -
Feb 28, 2023
filing date -
Jul 5, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package includes a flexible base film, a semiconductor chip on a first surface of the base film, and a heat radiating member on a second surface of the base film. The base film has a recess pattern in the second surface. The recess pattern is adjacent the semiconductor chip. The heat radiating member may be in the recess pattern.
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