DEVICE FOR SOLIDIFYING A COATING LAYER HOT-DEPOSITED ON A WIRE,CORRESPONDING INSTALLATION AND METHOD
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United States of America Patent
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Issued Date -
Jan 11, 2024
app pub date -
Sep 20, 2023
filing date -
May 16, 2019
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Abstract
Device for solidifying a coating layer hot deposited on a wire, corresponding installation and method. The device comprises a cooling liquid injection chamber with a liquid inlet and a wire inlet, a cooling chamber with a liquid outlet and a wire outlet, and a partition arranged between the injection and cooling chambers, comprising a wire passage. It also has a conduit for separating the wire. The partition comprises channels fluidically connecting the injection chamber with the cooling chamber and leading into the center of the wire passage in an eccentric manner and being inclined forming an angle (α) with respect to a longitudinal direction. This directs a jet of cooling liquid on the wire in the direction from the injection chamber towards the cooling chamber.
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