ALUMINUM ALLOY, ELECTRONIC DEVICE, AND ALUMINUM ALLOY PREPARATION METHOD
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United States of America Patent
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Issued Date -
Jan 11, 2024
app pub date -
Sep 21, 2023
filing date -
Mar 22, 2021
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Abstract
This application provides an aluminum alloy, an electronic device, and an aluminum alloy preparation method. The aluminum alloy, based on mass percentage, includes the following components: silicon: 8.0%-10.0%, magnesium: 0.001%-0.2%, manganese: 0.001%-0.09%, iron: 0.7%-1.3%, and strontium: 0.001%-0.05%, with a balance of aluminum and inevitable impurities, where the inevitable impurities account for ≤0.15%. The aluminum alloy has characteristics of a high heat conductivity, good molding performance, favorable corrosion resistance, and favorable mechanical properties without heat treatment.
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