CURABLE COMPOSITION, CURED PRODUCT, AND ADHESIVE

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United States of America Patent

APP PUB NO 20240010782A1
SERIAL NO

18035798

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Abstract

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Provided are a curable composition, a cured product thereof, and an adhesive. The curable composition contains a blocked isocyanate prepolymer (A) formed from a polyol compound (a1), a polyisocyanate compound (a2), and a blocking agent (a3) as essential raw materials, an epoxy resin (B), and a curing agent (C). The blocking agent (a3) contains a phenol compound having a hydrocarbon group having 12 or more carbon atoms. The curable composition has excellent adhesive properties and resistance to humidity and heat, and can be suitably used for an adhesive and the like.

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Patent Owner(s)

Patent OwnerAddress
DIC CORPORATION35-38 SAKASHITA 3-CHOME ITABASHI-KU TOKYO 1748520

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ozawa, Ryosuke Ichihara-shi, JP 9 13
Suganuma, Hajime Ichihara-shi, JP 3 1
Yamazaki, Takeshi Ichihara-shi, JP 238 3244

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