HEAT DISSIPATION HOLDER
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United States of America Patent
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Issued Date -
Jan 4, 2024
app pub date -
Jan 13, 2023
filing date -
Jul 4, 2022
priority date (Note) -
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Abstract
A heat dissipation holder applied to a handheld electronic device is provided. The heat dissipation holder includes a base, a cover, a heat dissipation module, and an air guiding structure. The base includes a first side and a second side that are opposite to each other and a front surface and a rear surface that are opposite to each other. The first side includes a first opening. The cover is combined onto the front surface to form an accommodating space with the base. The cover includes an air inlet region. The heat dissipation module is disposed in the accommodating space. The air guiding structure is disposed on the cover and extends to the first opening. The first opening, the air inlet region, and the air guiding structure form an airflow channel between the heat dissipation module and the cover.
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