SUBSTRATE PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
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United States of America Patent
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Issued Date -
Jan 4, 2024
app pub date -
Sep 15, 2023
filing date -
Mar 26, 2021
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status (Latency Note)
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Abstract
A substrate package in which chip-on-films (COFs) are attached to both surfaces of a display panel and a display device including the substrate package are provided. The display device includes: a display panel displaying data on a screen; and a plurality of first packages and a plurality of second packages where chips for driving the display panel are installed, the first packages and the second packages being attached to an end portion of the display panel, wherein the first packages and the second packages are attached through different surfaces of the display panel.
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