PROTECTIVE PACKAGE ASSEMBLY

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240006211A1
SERIAL NO

18329271

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A protective package assembly includes middle, upper, and lower packages. The middle package includes side buffer boards. The side buffer boards are connected in a ring shape to form an accommodating space communicated with upper and lower openings. The upper package includes an upper buffer board and upper buffer members. The upper buffer board is configured to cover the upper opening. The upper buffer members are distributed at intervals and protrude from a surface of the upper buffer board. The upper buffer members are disposed toward the interior of the accommodating space. The lower package includes a lower buffer board and lower buffer members. The lower buffer board is configured to cover the lower opening. The lower buffer members are distributed at intervals and protrude from a surface of the lower buffer board. The lower buffer members are disposed toward the interior of the accommodating space.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78
GUDENG PRECISION INDUSTRIAL CO LTD9F NO 2 SEC 4 ZHONGYANG RD TUCHENG DIST NEW TAIPEI 236

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHIANG, Tzu Ang I-lan, TW 10 3
CHIU, Ming-Chien NEW TAIPEI CITY, TW 120 362
CHUANG, Chia-Ho NEW TAIPEI CITY, TW 61 89
HUANG, Yi-Feng Kaohsiung City, TW 37 763
LEE, Kuo-Hua NEW TAIPEI CITY, TW 62 870
LIN, Tsung-Yi Tainan City, TW 50 346
LYU, Jyun-Ming NEW TAIPEI CITY, TW 9 2
SHEN, En-Nien NEW TAIPEI CITY, TW 13 2

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