ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Jan 4, 2024
app pub date -
Sep 18, 2023
filing date -
Feb 13, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing an electronic apparatus includes the steps of: providing an electronic panel defining a through hole; providing an electronic module having at least a portion thereof received in the through hole; providing a protective member having a first surface adjacent to the electronic panel, a hole area overlapping the through hole, a peripheral area surrounding the hole area, and a second surface facing the first surface and spaced apart from the electronic module, the providing of the protective member including: providing an unfinished protective member; attaching a film to the peripheral area; and forming a generally concave-convex pattern by contacting an acid solution with the hole area.
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