COPOLYMERS OF DIISOALKENYLARENE AND COMPOSITIONS THEREOF
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United States of America Patent
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Issued Date -
Jan 4, 2024
app pub date -
Sep 18, 2023
filing date -
Dec 23, 2020
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Abstract
The disclosure relates to a thermosetting composition comprising a copolymer of (a) a diisoalkenylarene (DIAEA), and (b) a divinylarene (DVA) comprising m-DVB, p-DVB, m-EVB, p-EVB, and mixtures thereof. A mole ratio of DIAEA to DVA is from 15:1 to 1:15. The thermosetting composition after curing at a temperature of ≥120° C. is characterized as having: a Gel Content of >90%, a Dk of <2.6 and Df of <0.002, both measured at 10 GHz, according to ASTM D2520. The thermosetting composition provides improved thermal stability at high temperature and excellent processability when used electronic applications as metal-clad laminates and build-up films.
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