CURABLE POLYMER COMPOSITION
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United States of America Patent
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Issued Date -
Jan 4, 2024
app pub date -
Jun 30, 2023
filing date -
Jul 1, 2022
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Abstract
The disclosure relates to a curable polymer composition comprising (i) a copolymer of a diisoalkenylarene (DIAEA) and a divinylarene (DVA), and (ii) at least one anti-scorching agent. The copolymer has a solubility in a hydrocarbon solvent at 25° C. for a period of less than 4 hours of at least 10 wt. %, a glass transition temperature (Tg) of 50 to 300° C., and a Gel Content of less than 5 wt. %. The curable polymer composition is cured at a temperature of greater than 140° C. to obtain a cured polymer composition having a Gel Content in a hydrocarbon solvent of >90%, and low Dk and Df values. The curable polymer composition does not cross-link or has minimal premature cross-linking in steps such as processing, storage, etc., and can be used in copper clad lamination applications.
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