SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE
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United States of America Patent
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Issued Date -
Jan 4, 2024
app pub date -
Oct 29, 2021
filing date -
Nov 30, 2020
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Abstract
A substrate processing method includes a substrate holding step of holding a substrate at a holding position surrounded by a cylindrical guard, a processing liquid supplying step of supplying a processed surface of the substrate with a processing liquid with which the processed surface of the substrate is processed while rotating the substrate held at the holding position about a rotation axis passing through a central portion of the substrate, an image acquiring step of acquiring an image of the processed surface of the substrate and an image of an inner wall surface of the guard while supplying the processing liquid to the processed surface of the substrate, and a detecting step of monitoring luminance values of the images obtained in the image acquiring step, and detecting a processing end time point at which processing of the processed surface of the substrate with the processing liquid is ended.
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