COMPOSITE INTERCONNECTION CONDUITS FOR HVAC SYSTEMS
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United States of America Patent
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Issued Date -
Dec 28, 2023
app pub date -
Sep 11, 2023
filing date -
Sep 11, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.
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