BUFFER CHAMBER, SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

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United States of America Patent

APP PUB NO 20230415191A1
SERIAL NO

18097408

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a batch-type treating bath for treating a substrate in a batch-type manner; a single-type treating chamber for treating the substrate in a single-type manner; and a buffer chamber positioned on a transfer path of the substrate transferred between the batch-type treating bath and the single-type treating chamber, and supplying a liquid for maintaining a wetting state of the substrate.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTDSOUTH KOREA CHUNGNAM CHEONAN CITY CHEONAN JEOLLANAM-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOI, JUN YOUNG Cheongju-si, KR 103 402
JANG, YOUNG JIN Cheonan-si, KR 41 76
LEE, YOUNG HUN Cheonan-si, KR 56 86
LIM, JUN HYUN Seoul, KR 8 1
PARK, GUI SU Cheonan-si, KR 19 20

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