CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Dec 21, 2023
app pub date -
Nov 19, 2021
filing date -
Nov 20, 2020
priority date (Note) -
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Abstract
A circuit board according to an embodiment includes a first insulating layer including a first region and a second region; and a first circuit pattern layer disposed on the first insulating layer; wherein the first circuit pattern layer includes a first electrode disposed on the first region of the first insulating layer and including a first opening, and wherein the first opening pass through upper and lower surfaces of the first electrode.
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